SMTA Austin Expo & Tech Forum

Date: February 12, 2026
Time: 1:00PM
Location: Travis County Exposition Center
7311 Decker Lane
Austin, Texas  78724
United States

Description:
This presentation provides a focused overview of modern SMT stencil design and fabrication, delivered by Elias Malfavon Jr., a subject matter expert in the field. The session begins with an examination of critical design principles for optimizing solder paste deposition. We will look at specific strategies for aperture size and shape modifications to address common printing and reflow defects, along with special considerations for different types of pad definitions and topographical features on the circuit board.  The discussion then moves to the manufacturing process itself. Attendees will gain an appreciation for the evolution of stencil production, from legacy techniques to the precision of modern stencil lasers. We will also touch on alternative fabrication methods, like electroforming and take a look at emerging fabrication technologies being driven by miniaturization. The presentation concludes with a review of stencil materials, covering the history of substrates and the benefits of today’s advanced alloys, surface modifications, and Nano-coatings. This talk is designed to give engineers and technicians practical knowledge to improve their SMT assembly process. 

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